DSF/PREN IEC 61189-2-807
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA
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| Organization: | DS |
| Status: | active |
| Page Count: | 10 |
scope:
This International Standard specifies a test method to determine the decomposition temperature(Td) of base laminate materials using thermogravimetric analysis (TGA).
Document History
October 18, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (T;lt;sub;gt;d;lt;/sub;gt;) using TGA
This International Standard specifies a test method to determine the decomposition temperature(Td) of base laminate materials using thermogravimetric analysis (TGA).
DSF/PREN IEC 61189-2-807
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA
This International Standard specifies a test method to determine the decomposition temperature(Td) of base laminate materials using thermogravimetric analysis (TGA).