DS/EN IEC 61189-2-807
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (T;lt;sub;gt;d;lt;/sub;gt;) using TGA
active, Most Current
| Organization: | DS |
| Publication Date: | 18 October 2021 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This International Standard specifies a test method to determine the decomposition temperature(Td) of base laminate materials using thermogravimetric analysis (TGA).
Document History
DS/EN IEC 61189-2-807
October 18, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition temperature (T;lt;sub;gt;d;lt;/sub;gt;) using TGA
This International Standard specifies a test method to determine the decomposition temperature(Td) of base laminate materials using thermogravimetric analysis (TGA).
Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-807: Test methods for materials for interconnection structures – Decomposition Temperature (Td) using TGA
This International Standard specifies a test method to determine the decomposition temperature(Td) of base laminate materials using thermogravimetric analysis (TGA).