IEC 62899-202-7
Printed electronics – Part 202-7: Materials – Printed film – Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
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| Organization: | IEC |
| Publication Date: | 1 March 2021 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Printed circuits and boards): | 31.180 |
| ICS Code (Insulating materials in general): | 29.035.01 |
scope:
This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional metal electroplating on the printed layer. The method described in this document can be used to compare the peel strengths of the printed layers on the same flexible substrate and thickness conditions. It can be used when the adhesion between the printed layer and flexible substrate is weaker than any other interface between the printed layer and the adhesive, the adhesive and the panel.
Document History
IEC 62899-202-7
March 1, 2021
Printed electronics – Part 202-7: Materials – Printed film – Measurement of peel strength for printed layer on flexible substrate by the 90° peel method
This part of IEC 62899 provides a test method to measure the peel strength of a printed layer on a flexible substrate. This method calls for peeling the flexible substrate instead of an additional...