scope:

This standard provides guidelines and requirements for die products used in other than conventionally packaged microcircuit or discrete formats. The die described herein are intended to be high quality, reliable bare die, for use in a variety of user - defined applications (e.g., multi-chip modules (MCM), System in a Package (SiP), memory cards, etc.) While this standard allows negotiation between supplier and user to establish specific requirements for performance, quality and reliability, it is important to recognize, in the case of military and aerospace applications, the minimum requirements described in relevant military specifications.

This standard is limited to die products consisting of a single microcircuit or discrete device connected using conventional wire bonding or High Density Interconnect. KGD products are intended to be equivalent to or better than comparable packaged parts in terms of electrical and reliability performance (unless specifically noted by the supplier). Per requirements mutually agreed upon by the KGD supplier and user, the KGD supplier shall implement and demonstrate testing and screening required to assure this performance.

This standard deals only with die products supplied in individual die form, for which the user accepts responsibility for providing and assuring final environmental protection (e.g., hermetic sealing, plastic encapsulation).