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BSI - BS PD IEC TR 61191-8

Printed board assemblies Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units — Best practices

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Organization: BSI
Publication Date: 31 March 2021
Status: active
Page Count: 38
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180

Document History

BS PD IEC TR 61191-8
March 31, 2021
Printed board assemblies Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units — Best practices
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References

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