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ISO 10303-210

Industrial automation systems and integration — Product data representation and exchange — Part 210: Application protocol: Electronic assembly, interconnect and packaging design

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Organization: ISO
Publication Date: 1 March 2021
Status: active
Page Count: 1
ICS Code (Industrial process measurement and control): 25.040.40
scope:

This document specifies the use of the integrated resources necessary for the scope and information requirements for electronic assembly interconnect and packaging design

NOTE The scope of this document is further refined in the application activity model in Annex F.

The following are within the scope of this document:

• configuration control data pertaining to the design phase of a product's development;

• characterization data that includes:

◦ the identification of assumed, required, planned or actual parameters for functional objects, assemblies, interconnect, components,and analytical models;

◦ the description of catalogue data including explicit capability for binding externally defined data element type identifiers to product data types;

◦ chemical substance composition, composite material product structure, conductivity performance measures, shape and material properties;

◦ characterization of surface conditions including surface finish;

◦ electrical and mechanical part data, including data for bare semiconductor devices, cables and electrical connectors;

◦ the description of conductive pattern templates associated with the part;

◦ representation of interface and seating planes in the physical description of the device;

◦ representation of the shape of a device under different application contexts and material conditions;

◦ the functional and physical interface definition of devices or physical objects, or of features realized as part of the interconnect;

◦ the mapping between the functional and physical interface definitions;

• the explicit interface to externally defined models that define the behaviour of a functional object, a device, a physical object, an electronic assembly, or an interconnect;

• requirement data;

• functional and physical network data;

• electrical or mechanical assembly data that includes:

◦ the physical layout of the assembly, including a description of the placement of the physical objects in the assembly and the description of the constraints on the design of the assembly;

◦ the allocation of domain specific elements of the assembly design description to the interface description of a part;

◦ the allocation of each specific connection among the devices used in the assembly to the component or group of componentsthat realizes that connection;

◦ the description of assembly panels used for manufacturing assemblies in lot quantities;

◦ representation of the joint between a feature of a component in the role of interconnect and a feature of a component that is in the role of function implementation;

• interconnect data that includes:

◦ discrete wiring based interconnect data;

◦ cable based interconnect data;

◦ the description of components in the assembly that help realize the interconnect;

◦ layered substrate based connectivity data;

◦ the description of the material stackup, including stackups for sequential laminates and complex configurations of multiple sub-stacks;

◦ the description of conductive and non-conductive materials and patterns, with the option to exclude design intent;

◦ the description of composite structures for non-conductive materials;

◦ representation of hierarchical footprint patterns, including breakout patterns;

◦ the description of fabrication panels used for manufacturing substrates in lot quantities;

• multi-domain model data that includes:

◦ the description of electrical, thermal, mechanical sub-models including two and three dimensional shape representations;

◦ the description of the explicit relationships required to maintain consistency between the sub-models;

• two and three dimensional shape representations,including geometric validation properties, of a part, assembly, or interconnect;

• geometric and dimensional tolerances applied to geometric shape representations;

• two and three dimensional presentation, including technical drawings, of product data.

The following are outside the scope of this document:

• the classification and categorization of data element types;

• the definition and interpretation of external file formats for simulation models;

• the plans for or the management of the process used to design or manufacture a product;

• product definition data and configuration control data pertaining to any life-cycle phase other than design.

Document History

ISO 10303-210
March 1, 2021
Industrial automation systems and integration — Product data representation and exchange — Part 210: Application protocol: Electronic assembly, interconnect and packaging design
This document specifies the use of the integrated resources necessary for the scope and information requirements for electronic assembly interconnect and packaging design NOTE The scope of this...
December 1, 2014
Industrial automation systems and integration - Product data representation and exchange - Part 210: Application protocol: Electronic assembly, interconnect and packaging design
A description is not available for this item.
January 15, 2011
Industrial automation systems and integration — Product data representation and exchange — Part 210: Application protocol: Electronic assembly, interconnect, and packaging design
A description is not available for this item.
May 15, 2001
Industrial Automation Systems and Integration - Product Data Representation and Exchange - Part 210: Application Protocol: Electronic Assembly, Interconnection, and Packaging Design
This part of IS0 10303 specifies the use of the integrated resources necessary for the scope and information requirements for the design of electronic assemblies, interconnect and packaging. NOTE...

References

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