scope:

This part of IS0 10303 specifies the use of the integrated resources necessary for the scope and information requirements for the design of electronic assemblies, interconnect and packaging.

NOTE The application activity model (AM) in Annex G provides a graphical representation of the processes and information flows that are the basis for the dehition of the scope of this part of IS0 10303.

The following are within the scope of this part of IS0 10303:

- The hierarchical description of the functionality of the electronic assembly or interconnect or devices that are used in an electronic assembly or interconnect;

- The hierarchical description of the functional objects that are combinations of one or more functional objects;

- The configuration management of the functional objects that are being developed concurrently;

- The configuration management of analytical models that are being developed concurrently;

- The explicit interface to analytic models that are used to define the behaviour of a functional object, a device, a physical object, an electronic assembly, or an interconnect;

- The description of the connection among the functional objects;

- The description of the connection among the devices used in the electronic assembly or interconnect;

- The description of the requirements for physical interconnection;

- The physical layout of the electronic assembly, including a description of the placement of the physical objects in the electronic assembly;

- The description of the bare interconnect, including the conductive and non-conductive materials and patterns;

- The functional and physical description of devices or physical objects, including material characteristics and composition;

- The functional usage and physical usage description of devices or physical objects, including material characteristics and composition;

- The functional and physical description of devices or physical objects realized as part of the interconnect, including material characteristics and composition;

- The functional usage and physical usage description of devices or physical objects realized as part of the interconnect, including material characteristics and composition;

- The description of the requirements and constraints on the design of the electronic assembly that assure product performance, incorporate quality, and enhance manufacturing process capabilities;

- The description of the requirements and constraints on the design of the interconnect that assure product performance, incorporate quality, and enhance manufacturing process capabilities;

- The configuration management of electronic assembly design descriptions;

- The configuration management of interconnect design descriptions;

- The allocation of certain details of the interconnect design description to the usage description of a physical object;

- The allocation of certain details of the electronic assembly design description to the usage description of a physical object;

- The description of electronic assemblies to implement various functional domains including, but not limited to, analogue, digital, video, radio frequency, and microwave;

- The description of interconnect to implement various functional domains including, but not limited to, analogue, digital, video, radio frequency, and microwave;

- The configuration management of constituent parts that are electronic assemblies or interconnect and that are being concurrently developed;

- The configuration management of documents that contain requirements;

- The allocation of requirements to functional objects, physical objects, and the physical implementation; The allocation of requirements from functional objects to their physical implementation;

- The allocation of each specific connection among the devices used in the electronic assembly to the component or group of components that realizes that connection;

- The association of characteristics to functional objects, physical objects, and analytical models;

- The identification of planned parameters for functional objects, electronic assemblies, interconnect, components, and analytical models;

- The identification of actual parameters for functional objects, electronic assemblies, interconnect, components, and analytical models.

The following are outside the scope of this part of IS0 10303:

- The drawings of functional objects, physical objects, electronic assemblies and interconnect;

- The process plans for the assembly of the electronic assembly;

- The process plans for the fabrication of the interconnect;

- The classification and categorization of data element types;

- The definition and interpretation of external file formats for analytic models;

- The management of the process used to design an electronic assembly or interconnect;

- The management of the manufacture of the physical objects used in an electronic assembly;

- The administrative procurement and cost data used by an enterprise.