BSI - BS EN IEC 61189-5-301
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-301: General test methods for materials and assemblies — Soldering paste using fine solder particles
active, Most Current
| Organization: | BSI |
| Publication Date: | 31 May 2021 |
| Status: | active |
| Page Count: | 38 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
BS EN IEC 61189-5-301
May 31, 2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 5-301: General test methods for materials and assemblies — Soldering paste using fine solder particles
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