IEC - 62878-2-602
Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
active, Most Current
| Organization: | IEC |
| Publication Date: | 1 June 2021 |
| Status: | active |
| Page Count: | 28 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.
Document History
62878-2-602
June 1, 2021
Device embedding assembly technology – Part 2-602: Guideline for stacked electronic module – Evaluation method of inter-module electrical connectivity
This part of IEC 62878 specifies the requirements and evaluation methods of electrical connectivity. It is applicable to stacked electronic modules.