BSI - 23/30436874 DC
Draft BS EN 62878-2-603 Device embedding assembly technology Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
pending, Most Current
| Organization: | BSI |
| Publication Date: | 23 October 2023 |
| Status: | pending |
| Page Count: | 14 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
23/30436874 DC
October 23, 2023
Draft BS EN 62878-2-603 Device embedding assembly technology Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
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