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DLA - MIL-PRF-31032/5C (1)

PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS

active, Most Current
Organization: DLA
Publication Date: 10 June 2021
Status: active
Page Count: 56
scope:

Scope.

This specification covers the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic, thermosetting, or thermoplastic and thermosetting base materials, that will use soldering for component/part mounting (see 6.1.1). Mixed base material printed boards containing both thermoplastic and thermosetting resin base materials are also covered. The printed board may contain an internal metal core or external heat sink.

intended Use:

This specification sheet was developed for the use of verifying the performance of homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resin) or mixed... View More

Document History

MIL-PRF-31032/5C (1)
June 10, 2021
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
This specification sheet was developed for the use of verifying the performance of homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resin) or mixed thermoplastic and...
May 5, 2020
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
This specification sheet was developed for the use of verifying the performance of homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resin) or mixed thermoplastic and...
October 5, 2017
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
This specification sheet was developed for the use of verifying the performance of homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resin) or mixed thermoplastic and...
December 9, 2012
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
This specification sheet was developed for the use of verifying the performance of homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resin) or mixed thermoplastic and...
January 31, 2011
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
This specification sheet was developed for the use of verifying the performance of homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resin) or mixed thermoplastic and...
March 10, 2009
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
This specification sheet was developed for the use of verifying the performance of homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resin) or mixed thermoplastic and...
August 20, 2007
PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
This specification sheet was developed for the use of verifying the performance of homogenous thermoplastic resin base materials (primarily polytetraflouroethylene resin) or mixed thermoplastic and...

References

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