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GMW18415

High Bake Adhesion Promoter - Solventborne for TPO

active, Most Current
Organization: GMW
Publication Date: 1 September 2021
Status: active
Page Count: 4
scope:

This specification covers the requirements for a high bake 121 °C (250 °F) Solventborne adhesion promoter for Thermoplastic Polyolefin (TPO). The adhesion promoter may be conductive or nonconductive depending on the needs of the user.

Note: Nothing in this standard supercedes applicable laws and regulations.

Note: In the event of conflict between the English and domestic language, the English language shall take precedence.

Purpose/Material Description.

This adhesion promoter is part of a total product system and must meet requirements set forth in the specifications for other materials with which it is used. This specification shall be used in conjunction with the GMW14797, Approved Paint on Plastics Systems (APOPS), a section of GM Materials Approved Source List (GMMASL) which lists approved substrate, cleaning, priming, and topcoat combinations.

Specified herein are material requirements per the Manufacturing Engineering Vehicle Systems Paint Materials Group. These specifications are used to verify the materials have been processed to produce a finished product of quality consistent with that proven in initial qualification testing.

Symbols.

Not applicable.

Applicability.

Adhesion promoters covered under this standard are typically applied to a GM approved TPO substrate. Adhesion promoters are used under an approved coating system.

Remarks.

None.

Document History

GMW18415
September 1, 2021
High Bake Adhesion Promoter - Solventborne for TPO
This specification covers the requirements for a high bake 121 °C (250 °F) Solventborne adhesion promoter for Thermoplastic Polyolefin (TPO). The adhesion promoter may be conductive or nonconductive...

References

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