DSF/PREN ISO 9455-17
Soft soldering fluxes – Test methods – Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO/DIS 9455-17:2022)
pending
| Organization: | DS |
| Status: | pending |
| Page Count: | 27 |
| ICS Code (Brazing and soldering): | 25.160.50 |
scope:
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in solid or liquid form, or in the form of flux-cored solder wire, solder preforms or solder paste constituted with eutectic or near-eutectic tin/lead solders. This test method is also applicable to fluxes for use with lead-free solders. However, the soldering temperatures may be adjusted with agreement between tester and customer.
Document History
July 27, 2006
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues
This part of ISO 9455 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons.
DSF/PREN ISO 9455-17
Soft soldering fluxes – Test methods – Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO/DIS 9455-17:2022)
ISO 9455-17:2002 specifies a method of testing for deleterious effects that may arise from flux residues after soldering or tinning test coupons. The test is applicable to type 1 and type 2 fluxes in...