IEC - TR 62899-550-1
Printed electronics – Part 550-1: Quality assessment – Framework document on durability testing – Mechanical and thermal testing
| Organization: | IEC |
| Publication Date: | 1 October 2022 |
| Status: | active |
| Page Count: | 18 |
| ICS Code (Electronic components in general): | 31.020 |
| ICS Code (Mechanical testing): | 19.060 |
scope:
This part of IEC 62899, which is a Technical Report, provides a framework for evaluating the mechanical and thermal durability of printed and/or flexible electronics components and products. This includes the bending test, torsion test, stretching test, steady heat test as well as the thermal cycle test. These are typical conditions that are easily encountered in daily life for printed and/or flexible electronics components and products.
This document gives guidance for use for technical committees in the preparation of consistent standards relating to the quality assessment of printed and/or flexible electronics components and products. Consistent standards for durability testing will help users, including businesses, developers, vendors, and end users to select suitable methods for durability testing and make consistent test procedures for printed electronics.
Document History
