CEI - EN IEC 61760-2
Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
active, Most Current
| Organization: | CEI |
| Publication Date: | 1 May 2022 |
| Status: | active |
| Page Count: | 24 |
| ICS Code (Mechanical structures for electronic equipment): | 31.240 |
scope:
This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)
The object of this document is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs can cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".
Document History
EN IEC 61760-2
May 1, 2022
Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
This International Standard specifies the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting...
April 1, 2008
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
La presente Norma fa parte della serie 61760 relativa alla tecnologia a montaggio superficiale.
In particolare essa è una Guida applicativa che definisce le condizioni di trasporto ed...