BSI - 22/30383603 DC
Draft BS IEC 63215-4 Endurance test methods for die attach materials applied to power electronic devices Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices
pending, Most Current
| Organization: | BSI |
| Publication Date: | 16 December 2022 |
| Status: | pending |
| Page Count: | 21 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
22/30383603 DC
December 16, 2022
Draft BS IEC 63215-4 Endurance test methods for die attach materials applied to power electronic devices Part 4: Power cycling test method and reliability performance index for Die attach materials (Near Chip Interconnection) applied to module type power electronic devices
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