scope:

This document should be used in conjunction with the parent document, "Methodology for the Thermal Modeling of Component Packages1", the "Terms and Definitions document2", and subsidiary documents as they become available.

This document is intended to function as an OVERVIEW to support the effective use of Compact Thermal Model (CTM) methodologies as specified in the companion methods documents. At present, there are two such documents: "Two-Resistor Compact Thermal Model Guideline3" and "DELPHI Compact Thermal Model Guideline⁴."

The planned structure for this set of documents is indicated in Figure 1.

This OVERVIEW is intended to provide a context for the comparison of CTM methods by defining a number of qualitative criteria. A procedure for quantifying the relative accuracy of different CTM methods by the calculation of Boundary Condition Independence (BCI) and Boundary Condition Subset (BCS) Indices will be specified in the future document, BCI & BCS INDEX GENERATION STANDARD. The APPLICATION GUIDE FOR BCI AND BCS INDICES will be added at a later date to support the effective use of these indices.

In the realization that CTM methodology will continue to evolve, this modular structure has been adopted for the generation of appropriate standards and guidelines. The intent is that, as a CTM method reaches a certain level of maturity and recognition in the industry, a standard or guideline governing its use would be added as a subdocument to this OVERVIEW.