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JEDEC JESD 51-12

Guidelines for Reporting and Using Electronic Package Thermal Information

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Organization: JEDEC
Publication Date: 1 November 2012
Status: active
Page Count: 28
scope:

This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users.

The first goal is for the electronic package thermal information to be reported consistently by different suppliers. Suppliers may choose to summarize the results or present a subset of the results, but the complete test information should be available on request. The complete information to be reported is documented in the various JESD51 standards, but key elements are consolidated in this guideline for easy reference by both suppliers and users.

The second goal is for end users to be able to properly understand, interpret and use the data reported. The purpose of the JESD51 standards is to compare the thermal performance of various packages under standardized test conditions. While standardized thermal test information cannot apply directly to the many specific applications, the standardized results can help compare the relative thermal performance of different packages. A more meaningful comparison is possible if the test conditions are understood along with the factors affecting package thermal performance. Brief discussions of key topics are included in this guideline.

Document History

JEDEC JESD 51-12
November 1, 2012
Guidelines for Reporting and Using Electronic Package Thermal Information
This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used...
May 1, 2005
Guidelines for Reporting and Using Electronic Package Thermal Information
This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used...

References

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