JEDEC JESD 51
Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
active, Most Current
Buy Now
| Organization: | JEDEC |
| Publication Date: | 1 December 1995 |
| Status: | active |
| Page Count: | 8 |
scope:
This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of junction temperature for specific conditions. The data can be used for package design evaluation, device characterization and reliability predictions.
Document History
JEDEC JESD 51
December 1, 1995
Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)
This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of...
Related Products
Searching for related products...