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JEDEC JESD 51-10

Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements

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Organization: JEDEC
Publication Date: 1 July 2000
Status: active
Page Count: 18
scope:

This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Dual-Inline Packages (DIP) and Single-Inline Packages (SIP). It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-10 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.

Document History

JEDEC JESD 51-10
July 1, 2000
Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Dual-Inline Packages (DIP) and Single-Inline Packages (SIP). It is intended to be used in...

References

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