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CENELEC - EN IEC 60749-10

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly

active, Most Current
Organization: CENELEC
Publication Date: 1 June 2022
Status: active
Page Count: 16
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility of devices and subassemblies to withstand moderately severe shocks. The use of subassemblies is a means to test devices in usage conditions as assembled to printed wiring boards. Mechanical shock due to suddenly applied forces, or abrupt change in motion produced by handling, transportation or field operation can disturb operating characteristics, particularly if the shock pulses are repetitive. This is a destructive test intended for device qualification.

Document History

EN IEC 60749-10
June 1, 2022
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - Device and subassembly
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility...
August 28, 2002
Semiconductor Devices - Mechanical and Climatic Test Methods Part 10: Mechanical Shock
A description is not available for this item.

References

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