IEC 60749-10
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1
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| Organization: | IEC |
| Publication Date: | 1 August 2003 |
| Status: | active |
| Page Count: | 16 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
April 1, 2022
Semiconductor devices – Mechanical and climatic test methods – Part 10: Mechanical shock – Device and subassembly
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment. The method is intended to determine the compatibility...
IEC 60749-10
August 1, 2003
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock CORRIGENDUM 1
A description is not available for this item.
April 1, 2002
Semiconductor Devices - Mechanical and Climatic Test Methods - Part 10: Mechanical Shock
A description is not available for this item.