scope:

This specification establishes the general requirements for Multi-Chip Modules (MCM); hereafter referred to as devices (see Terms and Definitions section). An MCM may consist of two or more microcircuits and/or active and passive components packaged in any configuration and dimension; and may comprise the functionality of an entire system, sub system, or specific function.

Similarly, the physical package can range from a simple IC package with two die to a complex module that incorporates two or more Integrated circuits with active and/or passive components on a silicon interposer that is attached to an organic substrate. Section 8 describes how to determine if other reliability data is needed in addition the data acquired during single die device standard qualification.

Detailed performance requirements for a specific device are specified in the applicable device acquisition document. In the event of a conflict between this document and the agreed device acquisition document, the agreed device acquisition document will take precedence. For example, for military applications applicable MIL-PRF/MIL-Q documents shall be used, unless otherwise agreed in the acquisition document.

The purpose of this specification is to define requirements for and facilitate manufacturing, Qualification, and procurement of MCMs for a wide range of applications. Prerequisites for successful Reliability Qualification are good practices such as described in sections 4,5,6, etc. As specific MCMs or multi-dimensional designs mature, new qualifications guidelines will become available. This document is intended as a tool, for both device users and producers, which if effectively used, will result in the successful manufacture, qualification and delivery of devices that perform properly in the intended application.