CENELEC - EN IEC 61249-2-51
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 June 2023 |
| Status: | active |
| Page Count: | 22 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61249 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad (hereinafter referred to as IC carrier tape base materials).
This document is applicable to IC carrier tape base materials, which is a glue-coated material, one side is woven E-glass reinforced epoxy underlayer, and the other side is coated with adhesive and protected by release film.
Document History
EN IEC 61249-2-51
June 1, 2023
Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
This part of IEC 61249 specifies the construction, materials, property requirements, quality assurance, packaging, marking, storage of base materials for integrated circuit card carrier tape, unclad...