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IEC 61189-2

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures

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Organization: IEC
Publication Date: 1 May 2006
Status: active
Page Count: 128
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

 

Document History

IEC 61189-2
May 1, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures
This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed...
IEC 61189-2
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
IEC 61189-2
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.

References

This document references:
IEC 60068-2-78 - Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady state
Published by IEC on October 1, 2012
Scope and object This part of IEC 60068 establishes a test method for determining the ability of components or equipment to withstand transportation, storage and use under conditions of high...
This document references:
IEC 60068-2-2 - Environmental testing – Part 2-2: Tests – Test B: Dry heat
Published by IEC on July 1, 2007
INTRODUCTION General This publication deals with dry heat tests applicable both to heat-dissipating and non heat-dissipating specimens. For non heat-dissipating specimens, Tests Ba and Bb do not...
This document references:
IEC 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards)
Published by IEC on October 1, 2007
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document is referenced by:
IPC-WP/TR-584 - IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies
Published by IPC on August 1, 2007
This document summarizes the IPC position on the subject of ‘‘halogen-free'' materials for the electronics industry. Its initial release was developed over a period of three years and this revision...
This document is referenced by:
IEC 61249-2-21 - Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced Base Materials, Clad and Unclad - Non-halogenated Epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
Published by IEC on November 1, 2003
This part of IEC 61249 gives requirements for properties of non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad in...
This document is referenced by:
BS EN 61249-2-4 - Materials for Printed Boards and Other Interconnecting Structures - Part 2-4: Reinforced Base Materials, Clad and Unclad - Polyester Non-Woven/Woven Fibreglass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad
Published by BSI on May 8, 2002
A description is not available for this item.
This document is referenced by:
IEC 61249-2-1 - Materials for printed boards and other interconnecting structures Part 2-1: Reinforced base materials, clad and unclad Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
Published by IEC on January 1, 2005
This part of IEC 61249 gives requirements for properties of phenolic cellulose paper reinforced copper-clad laminated sheets, economic grade in thicknesses of 0,8 mm up to 3,2 mm. This standard...
This document is referenced by:
IEC 62496-2-2 - Optical circuit boards – Part 2-2: Measurements – Dimensions of optical circuit boards
Published by IEC on January 1, 2011
This part of IEC 62496 specifies the measurement procedures for dimensions related to interface information of optical circuit boards (OCB), defined in IEC 62496-4.
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