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IPC-WP/TR-584

IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies

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Organization: IPC
Publication Date: 1 August 2007
Status: active
Page Count: 40
scope:

This document summarizes the IPC position on the subject of ''halogen-free'' materials for the electronics industry. Its initial release was developed over a period of three years and this revision was also worked upon for another 3 years by a team representing every level of the electronics supply chain. This document is applicable to materials for interconnecting electronics including, but not limited to, copper-clad laminates and prepregs, resin coated copper foils, flexible materials and solder masks. This document reflects the state of the information and technology as of May 2007.

Document History

IPC-WP/TR-584
August 1, 2007
IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies
This document summarizes the IPC position on the subject of ‘‘halogen-free'' materials for the electronics industry. Its initial release was developed over a period of three years and this revision...
April 1, 2003
IPC White Paper and Technical Report on Halogen-Free Materials Used for Printed Circuit Boards and Assemblies
A description is not available for this item.

References

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