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IEC 61249-5-1

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

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Organization: IEC
Publication Date: 1 November 1995
Status: active
Page Count: 50
ICS Code (Printed circuits and boards): 31.180

Document History

IEC 61249-5-1
November 1, 1995
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
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References

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