IEC 61249-5-1
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
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| Organization: | IEC |
| Publication Date: | 1 November 1995 |
| Status: | active |
| Page Count: | 50 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
IEC 61249-5-1
November 1, 1995
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
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