Printed Boards - Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification
|Publication Date:||1 December 1996|
|ICS Code (Printed circuits and boards):||31.180|
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made.
This standard provides additional information necessary to supplement the requirements of the Generic Specification, IEC 2326-1, for the printed boards intended to be accepted under the IEC Quality Assessment System for Electronic Components (IECQ).
This standard establishes uniform requirements, specifies the characteristics to be assessed and the test methods to be used for quality conformance (whether by lot-by-lot inspection, process control, or periodic inspection).