UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

BSI - BS EN 61189-3

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

active, Most Current
Buy Now
Organization: BSI
Publication Date: 31 March 2008
Status: active
Page Count: 62
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61189-3
March 31, 2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
A description is not available for this item.
September 15, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.
September 15, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.
September 15, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.

References

Advertisement