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BSI - BS EN 61189-3

Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)

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Organization: BSI
Publication Date: 15 September 1997
Status: inactive
Page Count: 62
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180

Document History

March 31, 2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
A description is not available for this item.
September 15, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.
BS EN 61189-3
September 15, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.
September 15, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.

References

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