BSI - BS EN 61189-3
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
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| Organization: | BSI |
| Publication Date: | 15 September 1997 |
| Status: | inactive |
| Page Count: | 63 |
| ICS Code (Electronic component assemblies): | 31.190 |
| ICS Code (Printed circuits and boards): | 31.180 |
Document History
March 31, 2008
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
A description is not available for this item.
September 15, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.
BS EN 61189-3
September 15, 1997
Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.
September 15, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.