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IEC 61189-2

Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures

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Organization: IEC
Publication Date: 1 April 1997
Status: inactive
Page Count: 150
ICS Code (Printed circuits and boards): 31.180

Document History

May 1, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures
This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed...
IEC 61189-2
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
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