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IEC 61189-2

Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures

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Organization: IEC
Publication Date: 1 April 1997
Status: inactive
Page Count: 189
ICS Code (Printed circuits and boards): 31.180

Document History

May 1, 2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2: Test methods for materials for interconnection structures
This part of IEC 61189 provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed...
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
IEC 61189-2
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
A description is not available for this item.
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