IEC 61189-3
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards)
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| Organization: | IEC |
| Publication Date: | 1 October 2007 |
| Status: | active |
| Page Count: | 150 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
Scope and object
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
Document History
IEC 61189-3
October 1, 2007
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards)
Scope and object
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
November 1, 2006
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
Scope and object
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
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