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IEC 62326-1

Printed Boards - Part 1: Generic Secification

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Organization: IEC
Publication Date: 1 March 2002
Status: active
Page Count: 112
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 62326 defines capability approval (CA) procedures for printed boards. When IECQ recognition is required, the capability approval procedures of IEC 001002 should be used. In addition, a technology approval (TA) schedule may also be provided as an alternative for manufacturers employing a system of process control for establishing product conformity. Both CA and TA procedures apply to printed boards irrespective of their methods of manufacture, when they are ready for the mounting of components. The information and requirements may also be used for second-party approvals or for self-declaration by a manufacturer of products covered by these specifications.

 

Document History

IEC 62326-1
March 1, 2002
Printed Boards - Part 1: Generic Secification
This part of IEC 62326 defines capability approval (CA) procedures for printed boards. When IECQ recognition is required, the capability approval procedures of IEC 001002 should be used. In addition,...
IEC 62326-1
January 1, 1996
Printed Boards - Part 1: Generic Secification
A description is not available for this item.

References

This document references:
IEC 62326-4 - Printed Boards - Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification
Published by IEC on December 1, 1996
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made....
This document references:
IEC 62326-4-1 - Printed Boards - Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification - Section 1: Capability Detail Specification - Performance Levels A, B and C
Published by IEC on December 1, 1996
This Capability Detail Specification (Cap DS) is based on IEC 2326-4. It relates to rigid multilayer printed boards with interlayer connections manufactured with materials specified in 3.1. It...
This document references:
IEC 62326-4 - Printed Boards - Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification
Published by IEC on December 1, 1996
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made....
This document references:
IEC 61189-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards)
Published by IEC on October 1, 2007
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document references:
IEC 61249-2-12 - Materials for Printed Boards and Other Interconnecting Structures - Part 2-12: Sectional Specification Set for Reinforced Base Materials, Clad and Unclad - Epoxide Non-Woven Aramid Laminate of Defined Flammability, Copper-Clad
Published by IEC on January 1, 1999
A description is not available for this item.
This document references:
IEC 61249-2-4 - Materials for Printed Boards and Other Interconnecting Structures - Part 2-4: Reinforced Base Materials, Clad and Unclad - Polyester Non-Woven/Woven Fibreglass Laminated Sheet of Defined Flammability (Vertical Burning Test), Copper-Clad
Published by IEC on December 1, 2001
A description is not available for this item.
This document references:
IEC 62326-4-1 - Printed Boards - Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification - Section 1: Capability Detail Specification - Performance Levels A, B and C
Published by IEC on December 1, 1996
This Capability Detail Specification (Cap DS) is based on IEC 2326-4. It relates to rigid multilayer printed boards with interlayer connections manufactured with materials specified in 3.1. It...
This document is referenced by:
EN 60730-1 - Automatic electrical controls - Part 1: General requirements
Published by CENELEC on July 1, 2016
In general, this part of IEC 60730 applies to automatic electrical controls for use in, on, or in association with equipment for household and similar use. The equipment may use electricity, gas,...
This document is referenced by:
BS EN 60730-1 - Automatic electrical controls for household and similar use - Part 1: General requirements
Published by BSI on July 15, 2001
Applies to the inherent safety of automatic electrical controls for use in, on or in association with equipment for household and similar use, including controls for heating, air-conditioning and...
This document is referenced by:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
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