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IEC 61189-3

Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)

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Organization: IEC
Publication Date: 1 November 2006
Status: inactive
Page Count: 150
ICS Code (Printed circuits and boards): 31.180
scope:

Scope and object

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Document History

IEC 61189-3
October 1, 2007
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 3: Test methods for interconnection structures (printed boards)
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
IEC 61189-3
November 1, 2006
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
IEC 61189-3
April 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 3: Test Methods for Interconnection Structures (Printed Boards)
A description is not available for this item.

References

This document references:
IEC 62326-4 - Printed Boards - Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification
Published by IEC on December 1, 1996
This part of IEC 2326 is applicable to rigid multilayer printed boards irrespective of their method of manufacture. It is the basis on which agreements between manufacturer and user are to be made....
This document references:
IEC 60454-1 - Specifications for pressure-sensitive adhesive tapes for electrical purposes Part 1: General requirements
Published by IEC on April 1, 1992
This part of IEC 454 gives general requirements for pressure-sensitive adhesive tapes for electrical purposes
This document references:
IEC 62326-4-1 - Printed Boards - Part 4: Rigid Multilayer Printed Boards with Interlayer Connections - Sectional Specification - Section 1: Capability Detail Specification - Performance Levels A, B and C
Published by IEC on December 1, 1996
This Capability Detail Specification (Cap DS) is based on IEC 2326-4. It relates to rigid multilayer printed boards with interlayer connections manufactured with materials specified in 3.1. It...
This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document is referenced by:
BS EN 61189-2 - Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies - Part 2: Test Methods for Materials for Interconnection Structures
Published by BSI on November 30, 2006
A description is not available for this item.
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