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BSI - 23/30480992 DC

Draft BS EN IEC 60068-2-83 Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic omponents for surface mounting devices (SMD) by the wetting balance method using solder paste

pending
Organization: BSI
Publication Date: 10 October 2023
Status: pending
Page Count: 37
ICS Code (Electronic component assemblies): 31.190
ICS Code (Environmental testing): 19.040

Document History

23/30480992 DC
October 10, 2023
Draft BS EN IEC 60068-2-83 Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic omponents for surface mounting devices (SMD) by the wetting balance method using solder paste
A description is not available for this item.
BS EN 60068-2-83
November 30, 2011
Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
A description is not available for this item.

References

This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by IEC on June 1, 2019
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document references:
IEC 60068-3-13 - Environmental testing – Part 3-13: Supporting documentation and guidance on Test T – Soldering
Published by IEC on May 1, 2016
This part of IEC 60068 provides background information and guidance for writers and users of specifications for electric and electronic components, containing references to the test standards IEC...
This document references:
IEC 60194-2 - Printed boards design, manufacture and assembly – Vocabulary – Part 2: Common usage in electronic technologies as well as printed board and electronic assembly technologies
Published by IEC on December 1, 2017
This part of IEC 60194 covers terms and definitions related to printed board and electronic assembly technologies as well as other electronic technologies
This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
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