IEC/PAS 62483
Test method for measuring whisker growth on tin and tin alloy surface finishes
inactive
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| Organization: | IEC |
| Publication Date: | 1 September 2006 |
| Status: | inactive |
| Page Count: | 34 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
scope:
The methodology presented in this document, see Annex A for process flow, is applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn). This test method may not be sufficient for applications with special requirements, e.g., military or aerospace. Additional requirements may be specified in the appropriate requirements document.
The purpose of this PAS is to:
• Provide an industry-standardize
• Provide a consistent inspection protocol for tin whisker examination.
• Provide a standard reporting format.
Document History
September 1, 2013
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
This International Standard describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices....
IEC/PAS 62483
September 1, 2006
Test method for measuring whisker growth on tin and tin alloy surface finishes
The methodology presented in this document, see Annex A for process flow, is applicable for studying tin whisker growth from finishes containing a predominance of tin (Sn). This test method may not...