scope:

This standard establishes the requirements for a distinctive symbol and labels to be used to identify materials that are lead-free (Pb-free) and are capable of providing Pb-free 2^nd level interconnects, and for indicating certain types of Pb-free material and the maximum assembly temperature. It also establishes the requirements for labeling a bare board if the base resin is halogen free and the type of conformal coating used after assembly.

 This standard shall apply to all electronic components including passives, connectors, solid-state components and other devices that use solder to attach the device/ component to the board or assembly.

This standard shall not apply to:

• Lead as an alloying element in steel containing up to 0.35% lead by weight, aluminum containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.

• Lead in electronic ceramic parts (e.g., piezoelectronic devices).