UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

New! AI Engineering Assistant 
- Trained on our vast library of engineering resources.

BSI - BS EN 62137-3

Electronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints

active, Most Current
Buy Now
Organization: BSI
Publication Date: 31 March 2012
Status: active
Page Count: 47
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN 62137-3
March 31, 2012
Electronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints
A description is not available for this item.
BS DD IEC/PAS 62137-3
January 31, 2009
Electronics assembly technology - Selection guidance of evironmental and endurance test methods for solder joints
A description is not available for this item.

References

This document references:
IEC 62137-1-3 - Surface mounting technology – Environmental and endurance test methods for surface mount solder joint – Part 1-3: Cyclic drop test
Published by IEC on November 1, 2008
The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is...
This document references:
IEC 60068-2-78 - Environmental testing – Part 2-78: Tests – Test Cab: Damp heat, steady state
Published by IEC on October 1, 2012
Scope and object This part of IEC 60068 establishes a test method for determining the ability of components or equipment to withstand transportation, storage and use under conditions of high...
This document references:
IEC 60068-2-2 - Environmental testing – Part 2-2: Tests – Test B: Dry heat
Published by IEC on July 1, 2007
INTRODUCTION General This publication deals with dry heat tests applicable both to heat-dissipating and non heat-dissipating specimens. For non heat-dissipating specimens, Tests Ba and Bb do not...
This document references:
IEC 61760-1 - Surface mounting technology – Part 1: Standard method for the specification of surface mounting components (SMDs)
Published by IEC on July 1, 2020
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set...
View Less
View All

Related Products

Searching for related products...

Advertisement