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BSI - BS EN 62137-3

Electronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints

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Organization: BSI
Publication Date: 31 March 2012
Status: active
Page Count: 47
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN 62137-3
March 31, 2012
Electronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints
A description is not available for this item.
January 31, 2009
Electronics assembly technology - Selection guidance of evironmental and endurance test methods for solder joints
A description is not available for this item.

References

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