BSI - BS DD IEC/PAS 62137-3
Electronics assembly technology - Selection guidance of evironmental and endurance test methods for solder joints
inactive
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| Organization: | BSI |
| Publication Date: | 31 January 2009 |
| Status: | inactive |
| Page Count: | 46 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
March 31, 2012
Electronics assembly technology Part 3: Selection guidance of environmental and endurance test methods for solder joints
A description is not available for this item.
BS DD IEC/PAS 62137-3
January 31, 2009
Electronics assembly technology - Selection guidance of evironmental and endurance test methods for solder joints
A description is not available for this item.