scope:

This part of IEC 60317 specifies the requirements of solderable enamelled round copper winding wire of class 155 with a dual coating. The underlying coating is based on poly - urethane resin, which may be modified providing it retains the chemical identity of the original resin and meets all specified wire requirements. The superimposed coating is a bonding layer based on a thermoplastic resin. NOTE A modified resin is a resin that has undergone a chemical change, or contains one or more additives to enhance certain performance or application characteristics. The range of nominal conductor diameters covered by this standard is: - Grade 1B: 0,020 mm up to and including 0,800 mm; - Grade 2B: 0,020 mm up to and including 0,800 mm. The nominal conductor diameters are specified in clause 4 of IEC 60317-0-1.