UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IEC/TR 62258-4

Semiconductor die products – Part 4: Questionnaire for die users and suppliers

active, Most Current
Buy Now
Organization: IEC
Publication Date: 1 August 2012
Status: active
Page Count: 42
ICS Code (Other semiconductor devices): 31.080.99
scope:

This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including:

wafers;

singulated bare die;

die and wafers with attached connection structures;

minimally or partially encapsulated die and wafers.

This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards.

It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein.

Document History

IEC/TR 62258-4
August 1, 2012
Semiconductor die products – Part 4: Questionnaire for die users and suppliers
This part of IEC 62258 has been developed to facilitate the production, supply and use of semiconductor die products, including: wafers; singulated bare die; die and wafers with attached...
August 1, 2007
Semiconductor die products – Part 4: Questionnaire for die users and suppliers
A description is not available for this item.

References

Advertisement