DLA - SMD-5962-94540 REV A
MICROCIRCUIT, LINEAR, STEP-UP SWITCHING VOLTAGE REGULATOR, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 28 September 1995 |
| Status: | inactive |
| Page Count: | 10 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 MAX630 CMOS, low power, step-up switching regulator
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style H GDFP1-F10 or CDFP2-F10 10 flat pack P GDIP1-T8 or CDIP2-T8 8 dual-in-line X CDFP3-F190 10 flat pack
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VS+) . . . . . . . . . . . . . . . . . . 18 V Output current (LX) . . . . . . . . . . . . . . . . . . 525 mA peak Output current (LBD) . . . . . . . . . . . . . . . . . . 50 mA Output voltage (LX, LBD) . . . . . . . . . . . . . . . . 18 V Storage temperature range . . . . . . . . . . . . . . . −65°C to +160°C Junction temperature (TJ) . . . . . . . . . . . . . . . +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . 300°C Power dissipation (PD): Case outline H and X . . . . . . . . . . . . . . . . . 421 mW 2/ Case outline P . . . . . . . . . . . . . . . . . . . . 640 mW 3/ Thermal resistance, junction-to-case (ΘJC): Case outline H and X . . . . . . . . . . . . . . . . . 85°C/W Case outline P . . . . . . . . . . . . . . . . . . . . 55°C/W Thermal resistance, junction-to-ambient (ΘJA): Case outline H and X . . . . . . . . . . . . . . . . . 190°C/W Case outline P . . . . . . . . . . . . . . . . . . . . 125°C/W
SUPPLY voltage range (VS+) . . . . . . . . . . . . . . . 2.0 V to 16.5 V Ambient operating temperature range (TA) . . . . . . . . −55°C to +125°C Input voltage, LBR, CX, IC, and VFB . . . . . . . . . . − 0.3 V ≤ VS ≤ + 0.3 V
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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