CEI EN 60749-35
Semiconductor devices - Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components
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| Organization: | CEI |
| Publication Date: | 1 February 2012 |
| Status: | active |
| Page Count: | 28 |
scope:
This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for detecting anomalies (delamination, cracks, mould-compound voids, etc.) reproducibly and non-destructively in plastic packages.
Document History
CEI EN 60749-35
February 1, 2012
Semiconductor devices - Mechanical and climatic test methods Part 35: Acoustic microscopy for plastic encapsulated electronic components
This part of IEC 60749 defines the procedures for performing acoustic microscopy on plastic encapsulated electronic components. This standard provides a guide to the use of acoustic microscopy for...