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IPC - J-STD-004 CHINESE

Requirements for Soldering Fluxes

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Organization: IPC
Publication Date: 1 December 2008
Status: active
Page Count: 32

Document History

J-STD-004C CHINESE
January 1, 2022
Requirements for Soldering Fluxes
A description is not available for this item.
J-STD-004 CHINESE
December 1, 2008
Requirements for Soldering Fluxes
A description is not available for this item.
J-STD-004 CHINESE
December 1, 2008
Requirements for Soldering Fluxes
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and...
J-STD-004 CHINESE
January 1, 2004
Requirements for Soldering Fluxes
A description is not available for this item.

References

This document references:
TM-650 2.3.32D - Flux Induced Corrosion (Copper Mirror Method)
Published by IPC on June 1, 2004
This test method is designed to determine the removal effect the flux has (if any) on the bright copper mirror film which has been vacuum deposited on clear glass.
This document references:
ISO 9001 - Quality management systems — Requirements
Published by ISO on September 15, 2015
This International Standard specifies requirements for a quality management system when an organization: a) needs to demonstrate its ability to consistently provide products and services that meet...
This document references:
J-STD-003 - Solderability Tests for Printed Boards
Published by IPC on April 1, 2014
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
This document references:
TM-650 2.3.33D - Presence of Halides in Flux, Silver Chromate Method
Published by IPC on June 1, 2004
This qualitative test method is designed to determine the presence of chlorides and bromides in soldering flux by visual examination after placement on test paper.
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