DIN EN 62047-22
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 47F/128/CD:2012)
inactive
| Organization: | DIN |
| Publication Date: | 1 November 2012 |
| Status: | inactive |
| Page Count: | 14 |
| ICS Code (Electromechanical components in general): | 31.220.01 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
April 1, 2015
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
Dieser Teil der IEC 62047 legt ein Zug-Prüfverfahren fest, um elektromechanische Eigenschaften von leitfähigen dünnen Werkstoffen der Mikrosystemtechnik (MEMS) (en: micro-electromechanical systems)...
DIN EN 62047-22
November 1, 2012
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 47F/128/CD:2012)
A description is not available for this item.