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ASTM D5109

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards

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Organization: ASTM
Publication Date: 1 November 2012
Status: active
Page Count: 9
ICS Code (Printed circuits and boards): 31.180
ICS Code (Laminated sheets): 83.140.20
scope:

These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

*A Summary of Changes section appears at the end of this standard

Document History

ASTM D5109
November 1, 2012
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards. Metric...
October 10, 1999
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
1. Scope 1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring...
October 10, 1999
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermo-setting polymeric materials intended for fabrication of printed wiring boards. This...
January 1, 1994
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
A description is not available for this item.
June 15, 1993
STANDARD TEST METHODS FOR COPPER-CLAD THERMOSETTING LAMINATES FOR PRINTED WIRING BOARDS
A description is not available for this item.
August 31, 1990
STANDARD TEST METHODS FOR COPPER-CLAD THERMOSETTING LAMINATES FOR PRINTED WIRING BOARDS
A description is not available for this item.

References

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