Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
|Publication Date:||1 November 2012|
|ICS Code (Printed circuits and boards):||31.180|
|ICS Code (Laminated sheets):||83.140.20|
These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
*A Summary of Changes section appears at the end of this standard