ASTM International - ASTM D5109-99(2004)
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
| Organization: | ASTM International |
| Publication Date: | 10 October 1999 |
| Status: | inactive |
| Page Count: | 8 |
| ICS Code (Printed circuits and boards): | 31.180 |
| ICS Code (Laminated sheets): | 83.140.20 |
scope:
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.
1.2 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
1.3 The procedures appear in the following sections:
abstract:
These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring... View More
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