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ASTM International - ASTM D5109-12

Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)

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Organization: ASTM International
Publication Date: 1 November 2012
Status: inactive
Page Count: 9
ICS Code (Printed circuits and boards): 31.180
ICS Code (Laminated sheets): 83.140.20
scope:

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.

1.2 The procedures appear in the following sections:

Procedure Section
 Referenced Documents 2
 Conditioning 4
 Dielectric Breakdown Voltage Parallel to Laminations 13
 Dimensional Instability 19
 Dissipation Factor 14
 Flammability Rating Test 16
 Flexural Strength, Flatwise at Elevated Temperature 15
 Flexural Strength, Flatwise at Room Temperature 15
 Oven Blister Test 17
 Peel Strength Test at Elevated Temperature 10
 Peel Strength Test at Room Temperature 9
 Permittivity 14
 Pin Holes in Copper Surface 20
 Purity of Copper 5
 Scratches in Copper Surface 21
 Solder Float Test 8
 Solvent Resistance 7
 Surface Resistivity 11
 Volume Resistivity 11
 Terminology 3
 Thickness & Thickness Variation 18
 Warp or Twist 6
 Water Absorption 12

1.3 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.

1.4 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.

abstract:

These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring... View More

Document History

ASTM D5109-12
November 1, 2012
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards (Withdrawn 2020)
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards. 1.2...
October 10, 1999
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
These test methods establish the standard procedures for testing copper-clad laminates produced from fiber-reinforced thermosetting polymeric materials intended for fabrication of printed wiring...
October 10, 1999
Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards. 1.2...
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